Dielectric breakdown in High-K insulating layers: Reliability challenges and opportunities in neuromorphic computing

Authors

  • Fernando Leonel Aguirre, Doctorando Unidad de Investigación y Desarrollo de las Ingenierías (UIDI), Facultad Regional Buenos Aires, Universidad Tecnológica Nacional - Consejo Nacional de Investigaciones Científicas y Técnicas (CONICET) - Argentina
  • Félix Palumbo Director
  • Pedro Julían Codirector

DOI:

https://doi.org/10.33414/ajea.5.778.2020

Keywords:

Dielectric Breakdown, non-volatile memories, RRAM, MOS, Neuromorphic, Cross-bar

Abstract

The introduction of High-K dielectrics as a replacement of the commonly used Silicon dioxide for the insulating layer in MOS devices allowed to carry on with the scaling law proposed by Gordon Moore. Nevertheless, those innovative materials raised serious concern regarding their reliability aspects, with the dielectric breakdown among them. In this work the dielectric breakdown in HK dielectrics is statistically analyzed in terms of the intrinsic defect generation by both experimental measurements and computer simulations. Additionally, the dielectric breakdown mechanism is explored as the base mechanism for the realization of non-volatile memories and artificial synapses for the implementation of low power neuromorphic systems.

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Published

2020-10-05

How to Cite

Aguirre, F. L., Palumbo, F., & Julían, P. (2020). Dielectric breakdown in High-K insulating layers: Reliability challenges and opportunities in neuromorphic computing. AJEA (Proceedings of UTN Academic Conferences and Events), (5). https://doi.org/10.33414/ajea.5.778.2020

Conference Proceedings Volume

Section

Proceedings - Signal and Image Processing